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Title:
SUBSTRATE PROCESSING MACHINE, WORKING HEAD OF SUBSTRATE PROCESSING MACHINE, SUBSTRATE PROCESSING SYSTEM, AND PREPARATION PROCESSING PROGRAM FOR USING WORKING HEAD OF SUBSTRATE PROCESSING MACHINE
Document Type and Number:
WIPO Patent Application WO/2004/047512
Kind Code:
A1
Abstract:
Convenience, versatility, and the like, of a substrate processing machine are enhanced and a working head (21), e.g. a mounting head (21), being provided in the substrate processing machine, e.g. a component mounter, is made to be fixed removably. Preferably, a plurality of working heads (21) having different arrangements are made interchangeable. . The working head (21) is provided with a medium (400) for recording its inherent information, information concerning that working head (21) is recognized (500) based on the inherent information read out from the recording medium (400), and preparation processing for using a fixed working head is performed based on the information concerning the head thus recognized. As the preparation processing, a decision (512) whether that working head (21) can be used or not, selection (516) of a driver software corresponding to that working head (21), positional adjustment, i.e. calibration (522), concerning the operation of that working head (21), and the like, can be carried out automatically by the substrate processing machine.

Inventors:
KODAMA SEIGO (JP)
SUHARA SHINSUKE (JP)
Application Number:
PCT/JP2003/014757
Publication Date:
June 03, 2004
Filing Date:
November 19, 2003
Export Citation:
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Assignee:
FUJI MACHINE MFG (JP)
KODAMA SEIGO (JP)
SUHARA SHINSUKE (JP)
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Foreign References:
JP2002314293A2002-10-25
JP2003218589A2003-07-31
Attorney, Agent or Firm:
Kando, Norikazu (Nagoya-Bldg. 5th Floor 6-18, Meieki 4-chome, Nakamura-k, Nagoya-shi Aichi, JP)
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