Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2008/018295
Kind Code:
A1
Abstract:
Provided is a substrate processing method which improves productivity by accurately recognizing
an end point in ashing process. The substrate processing method is provided
with a step of detecting emission intensity; a step of calculating the change
quantity of the detected emission intensity; a step of detecting the end point
by the change quantity of the calculated emission intensity; a step of comparing
the detected end point with a prescribed time; and a step of displaying the comparison
results.
Inventors:
YASHIMA TSUKASA (JP)
NOGAMI SHIGEKI (JP)
EKKO HIROSHI (JP)
NOGAMI SHIGEKI (JP)
EKKO HIROSHI (JP)
Application Number:
PCT/JP2007/064541
Publication Date:
February 14, 2008
Filing Date:
July 25, 2007
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC (JP)
YASHIMA TSUKASA (JP)
NOGAMI SHIGEKI (JP)
EKKO HIROSHI (JP)
YASHIMA TSUKASA (JP)
NOGAMI SHIGEKI (JP)
EKKO HIROSHI (JP)
International Classes:
H01L21/3065
Foreign References:
| JP2002231695A | 2002-08-16 | |||
| JPH03181129A | 1991-08-07 | |||
| JP2003100708A | 2003-04-04 |
Attorney, Agent or Firm:
PATENT RELATED CORPORATION IPS (Yokohama Creation Square5-1, Sakaecho, Kanagawa-ku,Yokohama-sh, Kanagawa 52, JP)
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