Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/146338
Kind Code:
A1
Abstract:
This substrate processing method, wherein a substrate is processed by supplying a chemical agent to the front surface of the substrate on which a pattern is formed, comprises: a substrate holding step for holding a substrate; a chemical agent supply step for supplying the chemical agent at least to the front surface of the substrate; a low conductivity liquid supply step for supplying a low conductivity liquid, which has a lower conductivity than the chemical agent, to the front surface of the substrate for the purpose of eliminating static electricity of the substrate before the chemical agent supply step; and a high conductivity liquid supply step for supplying a high conductivity liquid, which has a conductivity that is lower than the conductivity of the chemical agent but higher than the conductivity of the low conductivity liquid, to the back surface of the substrate instead of the front surface, said back surface being on the reverse side of the front surface, for the purpose of eliminating static electricity of the substrate before the low conductivity liquid supply step.
Inventors:
HIGASHI KATSUEI (JP)
SUGAHARA YUJI (JP)
TAKEMATSU YUSUKE (JP)
ISHIKAWA TOMOYA (JP)
SUGAHARA YUJI (JP)
TAKEMATSU YUSUKE (JP)
ISHIKAWA TOMOYA (JP)
Application Number:
PCT/JP2018/047265
Publication Date:
August 01, 2019
Filing Date:
December 21, 2018
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
| JP2015192088A | 2015-11-02 | |||
| JP2015119128A | 2015-06-25 | |||
| JP2006080392A | 2006-03-23 | |||
| JP2003092343A | 2003-03-28 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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