Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/157353
Kind Code:
A1
Abstract:
A substrate processing method according to the present disclosure comprises a step for holding a substrate (W), a step for supplying a plating liquid (L), a step for covering the substrate, a step for heating the plating liquid, and a step for supplying a cooling gas. In the step for holding a substrate, a substrate is held with use of a holding part (52) that holds the substrate. In the step for supplying a plating liquid, a plating liquid is supplied to the upper surface of the held substrate. In the step for covering the substrate, the substrate is covered by a cover member (6) before or after the step for supplying a plating liquid. In the step for heating the plating liquid, the plating liquid on the substrate is heated by means of a heating part (63), which is provided onto the cover member, in a state where the substrate is covered by the cover member. In the step for supplying a cooling gas, a cooling gas is supplied to the lower surface of the substrate or to the holding part from a position below the substrate during the step for heating the plating liquid.
Inventors:
NIWA TAKAFUMI (JP)
Application Number:
PCT/JP2021/001776
Publication Date:
August 12, 2021
Filing Date:
January 20, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C18/16
Domestic Patent References:
| WO2003021657A1 | 2003-03-13 |
Foreign References:
| JP2005217164A | 2005-08-11 | |||
| JP2002129344A | 2002-05-09 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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