Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/042490
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing method and a substrate processing apparatus. The substrate processing method for processing a substrate W comprises a switching step and a processing step. In the switching step, an additive is switched between an anionic surfactant and a cationic surfactant. In the processing step, an etchant is supplied to the substrate W. In the processing step, the additive selected in the switching step is supplied to the substrate W.
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Inventors:
UEDA DAI (JP)
Application Number:
PCT/JP2022/021554
Publication Date:
March 23, 2023
Filing Date:
May 26, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306; H01L21/308
Foreign References:
| JP2021048369A | 2021-03-25 | |||
| JP2007258510A | 2007-10-04 | |||
| JPH10223590A | 1998-08-21 | |||
| JP2016527707A | 2016-09-08 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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