Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/145522
Kind Code:
A1
Abstract:
Provided is a substrate processing method for processing a substrate that has an obverse surface, which is a main surface that is exposed in order to form a pattern, and a reverse surface, which is a main surface on the opposite side from the obverse surface. The substrate processing method includes a smoothing process for smoothing the reverse surface prior to the exposure of the obverse surface for the purpose of forming the pattern. The smoothing process includes a protrusion removal step for removing protrusions present on the reverse surface of the substrate through chemical polishing, and a recess burial process for burying a fluid plastic material in recesses present on the reverse surface of the substrate after the protrusion removal step.
Inventors:
IWASAKI AKIHISA (JP)
OKUNO YASUTOSHI (JP)
OKUNO YASUTOSHI (JP)
Application Number:
PCT/JP2023/001054
Publication Date:
August 03, 2023
Filing Date:
January 16, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; G03F7/20
Foreign References:
| JP2019091746A | 2019-06-13 | |||
| JP2007258380A | 2007-10-04 | |||
| JP2015012200A | 2015-01-19 | |||
| JP2018133414A | 2018-08-23 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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