Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/181491
Kind Code:
A1
Abstract:
Provided are a substrate processing method and a substrate processing apparatus, that make possible the selective formation of a self-assembled monolayer having an improved functionality as a protective film; this is achieved by bringing about a uniform and improved film density and by suppressing or reducing the production of film defects. The present invention is a substrate processing method for processing a substrate that has, on a surface, a metal film formation region in which a metal film 1 is formed, and a non-metal film formation region in which the metal film 1 is not formed. The present invention comprises: an artificial oxide film formation step for forming an artificial oxide film 4 by oxidizing under atmospheric pressure a surface, of the metal film 1, that is not natively oxidized; and a self-assembled monolayer formation step for forming a self-assembled monolayer 6 on the artificial oxide film 4 by at least contacting the substrate surface with a processing solution that contains material for forming the self-assembled monolayer 6.
Inventors:
MIYAMOTO YASUHARU (JP)
YOSHIDA YUKIFUMI (JP)
YOSHIDA YUKIFUMI (JP)
Application Number:
PCT/JP2022/042886
Publication Date:
September 28, 2023
Filing Date:
November 18, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/768; H01L23/532
Foreign References:
| JP2021057563A | 2021-04-08 | |||
| JP2009032708A | 2009-02-12 | |||
| JP2004022699A | 2004-01-22 | |||
| JP2021520640A | 2021-08-19 | |||
| JP2020527866A | 2020-09-10 |
Attorney, Agent or Firm:
KOYAMA Yasushi et al. (JP)
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