Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/062703
Kind Code:
A1
Abstract:
Provided are a substrate processing method and a substrate processing apparatus that make it possible to selectively remove, in a satisfactory manner, a self-assembled monolayer that is provided to the surface of a substrate. The present invention is a substrate processing method for processing a substrate W that has a self-assembled monolayer 14 provided to a surface of the substrate, the method including: an ultraviolet light irradiation step S104 for irradiating the self-assembled monolayer 14 with ultraviolet light in an oxygen-atom-containing atmosphere, thereby reducing the water repellency of the surface of the self-assembled monolayer 14; and a removal step S105 for bringing an aqueous self-assembled monolayer removal solution into contact with the self-assembled monolayer 14 after the ultraviolet light irradiation step, thereby selectively removing the self-assembled monolayer 14.
Inventors:
MIYAMOTO YASUHARU (JP)
YOSHIDA YUKIFUMI (JP)
YOSHIDA YUKIFUMI (JP)
Application Number:
PCT/JP2023/021822
Publication Date:
March 28, 2024
Filing Date:
June 13, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306; H01L21/304
Foreign References:
| US20080116481A1 | 2008-05-22 | |||
| US20140273476A1 | 2014-09-18 | |||
| JP2005096312A | 2005-04-14 |
Attorney, Agent or Firm:
OMNI INTERNATIONAL PATENT LAW OFFICE, P.C. et al. (JP)
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