Title:
SUBSTRATE-PROCESSING METHOD, COMPUTER STORAGE MEDIUM, SUBSTRATE-PROCESSING SYSTEM, AND SUBSTRATE-PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/210432
Kind Code:
A1
Abstract:
A substrate-processing method comprising: (A) a step for applying a resist liquid to a substrate to form a resist film; (B) a step for performing an auxiliary exposure process of irradiating the resist film with light having a predetermined wavelength, separately from an exposure process of transferring a mask pattern to the resist film; (C) a step for supplying a development liquid to the resist film after the exposure process and the auxiliary exposure process to form a resist pattern; (D) a step for etching a layer to be etched on the substrate using the resist pattern as a mask; and (E) a step for revising the in-plane distribution of the amount of exposure in the auxiliary exposure process in the step (B), wherein in the step (E), the revision is performed on the basis of the result of the step (D) when the steps (A)-(D) are performed under conditions before the revision.
Inventors:
ASAHI YUICHI (JP)
SEINO TAKUYA (KR)
SEINO TAKUYA (KR)
Application Number:
PCT/JP2023/015376
Publication Date:
November 02, 2023
Filing Date:
April 17, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G03F7/20; H01L21/3065
Foreign References:
| JP2018060001A | 2018-04-12 | |||
| JP2010074043A | 2010-04-02 | |||
| JP2019507375A | 2019-03-14 | |||
| JP2013186191A | 2013-09-19 | |||
| JP2010141063A | 2010-06-24 | |||
| JP2008250141A | 2008-10-16 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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