Title:
SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROCESSING FLUID
Document Type and Number:
WIPO Patent Application WO/2022/024709
Kind Code:
A1
Abstract:
A substrate processing method includes: a processing film formation step for supplying a processing liquid to the surface of a substrate and solidifying or curing the processing liquid on the surface of the substrate, thereby forming a processing film on the surface of the substrate; an etching component formation step for performing an etching component formation process on the processing film, thereby forming an etching component in the processing film; an etching step for etching a surface layer portion of the substrate with the etching component formed in the etching component formation step; and a processing film removal step for supplying a peeling liquid to the surface of the processing film, thereby peeling the processing film from the surface of the substrate, and removing the processing film from the surface of the substrate.
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Inventors:
YOSHIDA YUKIFUMI (JP)
TAHARA KANA (JP)
TAHARA KANA (JP)
Application Number:
PCT/JP2021/025861
Publication Date:
February 03, 2022
Filing Date:
July 08, 2021
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
| JP2015165526A | 2015-09-17 | |||
| JP2013008897A | 2013-01-10 | |||
| JP2007059876A | 2007-03-08 | |||
| JP2015149410A | 2015-08-20 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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