Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/018219
Kind Code:
A1
Abstract:
A substrate processing method according to one mode of the embodiment includes a grinding step, a measurement step, a condition determination step, and a damaged layer removal step. At the grinding step, the surface (W1) of a substrate (W) is ground. At the measurement step, the thickness of the ground substrate is measured. At the condition determination step, a processing condition for a wet etching process to be performed on the substrate is determined on the basis of the measured thickness of the substrate. At the damaged layer removal step, a wet etching process is performed by supplying a processing liquid to the ground substrate on the basis of the determined processing condition to remove a damaged layer formed on the surface of the substrate.
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Inventors:
FUKUOKA TETSUO (JP)
KIMURA YOSHIO (JP)
KIMURA YOSHIO (JP)
Application Number:
PCT/JP2016/070712
Publication Date:
February 02, 2017
Filing Date:
July 13, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B24B7/00; B24B49/03; H01L21/306
Domestic Patent References:
| WO2007088755A1 | 2007-08-09 | |||
| WO2007083656A1 | 2007-07-26 |
Foreign References:
| JP2007207810A | 2007-08-16 | |||
| JP2004335923A | 2004-11-25 | |||
| JP2010003847A | 2010-01-07 | |||
| JP2003318154A | 2003-11-07 | |||
| JPH10154701A | 1998-06-09 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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