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Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/163672
Kind Code:
A1
Abstract:
Provided is a substrate processing method for removing a resist from a substrate on the surface of which the resist having a cured layer is formed, the method including: a substrate holding step in which the substrate is held; and a resist delamination step in which ozone gas and superheated steam are supplied to a plurality of fluid nozzles for mixing a plurality of fluids to generate liquid droplets, and a mixed gas of the ozone gas and the superheated steam is discharged from the plurality of fluid nozzles to the surface of the substrate to delaminate the resist from the surface of the substrate, the mixed gas containing ozone water droplets generated by mixing the ozone gas and the superheated steam.

Inventors:
SOTOKU KOTA (JP)
Application Number:
PCT/JP2017/005338
Publication Date:
September 28, 2017
Filing Date:
February 14, 2017
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/027; H01L21/304
Foreign References:
JP2009170554A2009-07-30
JP2010087419A2010-04-15
JP2013179341A2013-09-09
JP2005150460A2005-06-09
JP2004327537A2004-11-18
JP2003077824A2003-03-14
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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