Title:
SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/051620
Kind Code:
A1
Abstract:
The present invention makes it possible to remove adhered liquid by executing paddle processing on a movable member that nears and separates from the bottom surface of a substrate. Provided are: a first step by which, in a state with the movable member, which is able to move between a near position that nears the bottom surface of the substrate and a separation position that is separated from the bottom surface of the substrate more than the near position, positioned at the near position, a first liquid is supplied on the top surface of the substrate that is rotating at a first speed; a second step by which, in a state for which the rotation speed of the substrate has decelerated to a second speed that is less than the first speed and greater than zero, the first liquid is supplied to the top surface of the substrate; and a third step by which, in a state with the movable member positioned at the separation position, the movable member is rotated at a third speed that is faster than the second speed.
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Inventors:
NAKAI HITOSHI (JP)
Application Number:
PCT/JP2017/025229
Publication Date:
March 22, 2018
Filing Date:
July 11, 2017
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2003224100A | 2003-08-08 | |||
| JPH09167751A | 1997-06-24 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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