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Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/193920
Kind Code:
A1
Abstract:
A substrate processing method, including: a substrate holding step for holding a substrate that has a surface in which a metal is exposed; an inert gas substitution step for feeding an inert gas to the vicinity of the surface of the substrate and thereby substituting the atmosphere surrounding the surface of the substrate with an inert gas; an adjustment step for adjusting the pH of a rinsing liquid so as to form an inert state in which the metal does not react with the rinsing liquid, or so that the metal reacts with the rinsing liquid to form a passive state; and a rinsing liquid feeding step for feeding the pH-adjusted rinsing liquid to the surface of the substrate after the atmosphere surrounding the surface of the substrate has been substituted with the inert gas.

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Inventors:
IWASAKI AKIHISA (JP)
TAKAHASHI HIROAKI (JP)
Application Number:
PCT/JP2018/015123
Publication Date:
October 25, 2018
Filing Date:
April 10, 2018
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
JP2010056218A2010-03-11
JP2002373879A2002-12-26
JP2003109936A2003-04-11
JP2005251806A2005-09-15
JP2005327807A2005-11-24
JP2013105916A2013-05-30
JP2007201111A2007-08-09
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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