Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/187687
Kind Code:
A1
Abstract:
Provided is a substrate processing technique including a process of forming a liquid film on the upper surface of a substrate and adequately solidifying the liquid film. This substrate processing method comprises: an atmosphere control step of supplying dry gas to the surface of a substrate on which a pattern has been formed and liquid has been deposited, turning the surroundings of the substrate surface into a dry atmosphere; a liquid for solidification supply step of supplying a liquid to be solidified to the substrate surface; and a solidification step of solidifying the liquid film of the liquid to be solidified into a solid. The atmosphere control step starts prior to the forming of the liquid film of the liquid to be solidified supplied to the substrate in the liquid for solidification supply step.
Inventors:
UEDA DAI (JP)
SASAKI YUTA (JP)
HANAWA YOSUKE (JP)
KITAGAWA HIROAKI (JP)
SASAKI YUTA (JP)
HANAWA YOSUKE (JP)
KITAGAWA HIROAKI (JP)
Application Number:
PCT/JP2019/004460
Publication Date:
October 03, 2019
Filing Date:
February 07, 2019
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; B08B3/10; F26B5/10
Foreign References:
| JP2018022861A | 2018-02-08 | |||
| JP2014090167A | 2014-05-15 | |||
| JP2010199261A | 2010-09-09 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
Download PDF: