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Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/198575
Kind Code:
A1
Abstract:
A substrate processing method for drying a substrate including a pattern formation surface in which a pattern with a recess is formed. The substrate processing method comprises: a sacrifice layer forming step of forming a sacrifice layer conforming to a surface of the pattern on the pattern formation surface; a fill layer forming step of forming, in a state in which the sacrifice layer is formed, a fill layer for filling the recess of the pattern in the pattern formation surface; a vaporizing step of vaporizing the sacrifice layer in the state in which the fill layer is formed; and a peeling step of peeling, after the sacrifice layer has been vaporized, the fill layer from the pattern formation surface.

Inventors:
ABE HIROSHI (JP)
OKUTANI MANABU (JP)
KANEMATSU YASUNORI (JP)
Application Number:
JP2019/014686
Publication Date:
October 17, 2019
Filing Date:
April 02, 2019
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; F26B5/16; F26B9/00
Foreign References:
JP2013042094A2013-02-28
JP2018056553A2018-04-05
JP2011124313A2011-06-23
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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