SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

WIPO Patent Application WO/2020/105376

A1

This substrate processing method includes: a first liquid film forming step for supplying a processing liquid containing a solid forming substance to a surface of a substrate to form a first liquid film of the processing liquid on the surface of the substrate; a first solid film forming step for forming, from the first liquid film, a first solid film containing the solid forming substance in a solid state; a first solid film peeling removal step for supplying a peeling liquid for peeling the first solid film to the surface of the substrate to peel and remove the first solid film from the surface of the substrate; a second liquid film forming step for supplying the processing liquid to the surface of the substrate, after the first solid film has been removed from the surface of the substrate, to form a second liquid film of the processing liquid on the surface of the substrate; a second solid film forming step for forming, from the second liquid film, a second solid film containing the solid forming substance in a solid state; and a second solid film vaporizing removal step for removing the second solid film from the surface of the substrate by vaporizing the second solid film in such a manner that the liquid state thereof is skipped.

TAKAHASHI HIROAKI (JP)
FUJIWARA NAOZUMI (JP)
OTSUJI MASAYUKI (JP)
YOSHIDA YUKIFUMI (JP)
UEDA DAI (JP)

PCT/JP2019/042188

May 28, 2020

October 28, 2019

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SCREEN HOLDINGS CO LTD (JP)

H01L21/304

JP2018110220A	2018-07-12
JP2015162486A	2015-09-07
JP2012243869A	2012-12-10

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