Title:
SUBSTRATE PROCESSING METHOD, RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/111369
Kind Code:
A1
Abstract:
Provided is a substrate processing method by which a water mark is prevented from being generated on a substrate at a low cost. At the time of processing the substrate by using a chemical, humidity at the periphery of the substrate is adjusted corresponding to the type of the chemical. The humidity is adjusted at least in a drying process for drying the substrate (W). In one example, the humidity at the periphery of the substrate is adjusted at the time of supplying the substrate (W) with a fluid including IPA, i.e., a drying fluid, after processing the substrate (W) by using the chemical.
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Inventors:
TOKUNO, Yoshichika (5-55-15, Najima Higashi-ku, Fukuoka-sh, Fukuoka 43, 8130043, JP)
徳野 圭哉 (〒43 福岡県福岡市東区名島５－５５－１５ Fukuoka, 8130043, JP)
徳野 圭哉 (〒43 福岡県福岡市東区名島５－５５－１５ Fukuoka, 8130043, JP)
Application Number:
JP2007/056820
Publication Date:
October 04, 2007
Filing Date:
March 29, 2007
Export Citation:
Assignee:
TOKYO ELECTRON LIMITED (3-6 Akasaka 5-chome, Minato-ku Tokyo, 81, 1078481, JP)
東京エレクトロン株式会社 (〒81 東京都港区赤坂五丁目３番６号 Tokyo, 1078481, JP)
TOKUNO, Yoshichika (5-55-15, Najima Higashi-ku, Fukuoka-sh, Fukuoka 43, 8130043, JP)
東京エレクトロン株式会社 (〒81 東京都港区赤坂五丁目３番６号 Tokyo, 1078481, JP)
TOKUNO, Yoshichika (5-55-15, Najima Higashi-ku, Fukuoka-sh, Fukuoka 43, 8130043, JP)
International Classes:
F26B5/00; F26B11/18; F26B21/08; H01L21/304
Attorney, Agent or Firm:
YOSHITAKE, Kenji et al. (Kyowa Patent & Law Office, Room 323 Fuji Bldg.,2-3, Marunouchi 3-Chom, Chiyoda-ku Tokyo, 100-0005, JP)
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