Title:
SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR MANUFACTURING METHOD, AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/189010
Kind Code:
A1
Abstract:
In this substrate processing method, a substrate (W) that has a pattern PT including a plurality of structures (63) is processed. The substrate processing method includes: a step (S1) of subjecting the plurality of structures (63) to a predetermined process using a non-liquid to increase hydrophilicity of surfaces (62) of the plurality of structures (63) compared to before the predetermined process; and a step (S3) of supplying a process liquid to the plurality of structures (63) after the step (S1) of increasing the hydrophilicity.
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Inventors:
KOBAYASHI KENJI (JP)
SATO MASANOBU (JP)
NAKANO YUTA (JP)
SATO MASANOBU (JP)
NAKANO YUTA (JP)
Application Number:
PCT/JP2020/002540
Publication Date:
September 24, 2020
Filing Date:
January 24, 2020
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
| JP2011204944A | 2011-10-13 | |||
| JP2010251596A | 2010-11-04 | |||
| JP2009272411A | 2009-11-19 | |||
| JPH0497526A | 1992-03-30 | |||
| JPH0380538A | 1991-04-05 |
Attorney, Agent or Firm:
MAEI Hiroyuki (JP)
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