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Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/235373
Kind Code:
A1
Abstract:
A substrate processing method for processing a substrate to be processed that has a device formed on a surface thereof comprises: preparing, among a first separated substrate on a device-present side and a second separated substrate on a device-absent side that have been separated from a device substrate, the second separated substrate; and reutilizing and bonding the second separated substrate onto a substrate to be processed. A substrate processing system for processing a substrate to be processed that has a device formed on a surface thereof comprises a bonding unit for reutilizing and bonding, among a first separated substrate on a device-present side and a second separated substrate on a device-absent side that have been separated from a device substrate, the second separated substrate onto a substrate to be processed.

Inventors:
TANOUE HAYATO (JP)
MIZOMOTO YASUTAKA (JP)
YAMASHITA YOHEI (JP)
Application Number:
PCT/JP2020/018795
Publication Date:
November 26, 2020
Filing Date:
May 11, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; H01L21/301; H01L21/683
Foreign References:
JP2017041481A2017-02-23
JP2006108532A2006-04-20
JP2016035965A2016-03-17
JP2011171382A2011-09-01
JP2010263041A2010-11-18
JP2017024039A2017-02-02
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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