Title:
SUBSTRATE PROCESSING SYSTEM, AND INDICATION METHOD FOR SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2013/047127
Kind Code:
A1
Abstract:
According to the present invention, a load is reduced which is related to an operation for holding auxiliary equipment connected to a substrate processing device, and maintaining the auxiliary equipment. The present invention comprises the substrate processing device; the auxiliary equipment which is related to the substrate processing device, and connected directly or indirectly to the substrate processing device; a storage device which accommodates at least information related to the auxiliary equipment collected by the auxiliary equipment; and a display device which displays a connection relation between the substrate processing device and the auxiliary equipment based on the information accommodated in the storage device. The auxiliary equipment is an exhaust system which discharges gas and heat and a cylinder cabinet where a gas cylinder is located, and the display device displays a connection relation between the substrate processing device and the cylinder cabinet, and a connection relation between the substrate processing device and the exhaust system in connection with each other.
Inventors:
NAKANO MINORU (JP)
SAITO TSUYOSHI (JP)
SAITO TSUYOSHI (JP)
Application Number:
PCT/JP2012/072588
Publication Date:
April 04, 2013
Filing Date:
September 05, 2012
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC (JP)
NAKANO MINORU (JP)
SAITO TSUYOSHI (JP)
NAKANO MINORU (JP)
SAITO TSUYOSHI (JP)
International Classes:
H01L21/02; G05B19/418
Foreign References:
| JP2009044191A | 2009-02-26 | |||
| JP2001337706A | 2001-12-07 | |||
| JPH1028855A | 1998-02-03 | |||
| JPH09232200A | 1997-09-05 |
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