Title:
SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2019/013042
Kind Code:
A1
Abstract:
This substrate processing system is for processing a bonded substrate formed by bonding a to-be-processed substrate and a support substrate in such a manner as to reduce the thickness of a non-bonded surface of the to-be-processed substrate, and has: a periphery removal part that performs a process to remove the periphery of the to-be-processed substrate; a grinding part that grinds the non-bonded surface of the to-be-processed substrate, the periphery of which has been removed by the periphery removal part; a thickness measurement part that measures the thickness of the periphery of the bonded substrate while the periphery of the to-be-processed substrate is being removed by the periphery removal part; and a control part that controls the transition from the removal process by the periphery removal part to the grinding process by the grinding part on the basis of a measurement result of the thickness measurement part.
Inventors:
FUKUOKA TETSUO (JP)
Application Number:
PCT/JP2018/025175
Publication Date:
January 17, 2019
Filing Date:
July 03, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B24B7/04; B24B9/00; B24B49/12; H01L21/02
Foreign References:
| JP2005116614A | 2005-04-28 | |||
| JP2011171647A | 2011-09-01 | |||
| JPH10209408A | 1998-08-07 | |||
| JP2011155095A | 2011-08-11 | |||
| JP2015006709A | 2015-01-15 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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