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Patent Searching and Data


Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/208337
Kind Code:
A1
Abstract:
Provided is a substrate processing system provided with: a carrying in and out station through which a cassette that stores a substrate to be processed is carried in and out; a laser processing device which performs a laser process on the substrate to be processed; and a thinning device which makes the substrate to be processed thin, wherein the thinning device and the carrying in and out station are arranged at opposite sides with the laser processing device therebetween in a horizontal direction.

Inventors:
KAWAGUCHI, Yoshihiro (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
MORI, Hirotoshi (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
HISANO, Kazuya (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
Application Number:
JP2019/016369
Publication Date:
October 31, 2019
Filing Date:
April 16, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku Tokyo, 25, 〒1076325, JP)
International Classes:
H01L21/677; B23K26/60; B24B7/04; H01L21/301; H01L21/304
Foreign References:
JP2007235069A2007-09-13
JP2015082642A2015-04-27
JP2012124300A2012-06-28
JP2005508085A2005-03-24
JP2009049233A2009-03-05
JP2018166177A2018-10-25
Attorney, Agent or Firm:
ITOH, Tadashige et al. (16th Floor, Marunouchi MY PLAZA 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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