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Patent Searching and Data


Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/208338
Kind Code:
A1
Abstract:
This substrate processing system is provided with a pre-alignment device and a laser processing device. The pre-alignment device has: a pre-alignment stage that holds a substrate to be processed; and a detector that detects the center position and the crystalline orientation of the substrate to be processed held by the pre-alignment stage. The laser processing device has: a laser processing stage that holds the substrate to be processed; and a laser processing head for performing focused radiation of laser beams for processing the substrate to be processed onto the substrate to be processed held by the laser processing stage. The pre-alignment device is arranged above the laser processing device.

Inventors:
KAWAGUCHI, Yoshihiro (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
MORI, Hirotoshi (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
HISANO, Kazuya (1-1 Fukuhara, Koshi-sh, Kumamoto 16, 〒8611116, JP)
Application Number:
JP2019/016370
Publication Date:
October 31, 2019
Filing Date:
April 16, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku Tokyo, 25, 〒1076325, JP)
International Classes:
H01L21/677; B23K26/02; B23K26/03; B23K26/60; B24B7/04; H01L21/301; H01L21/304
Foreign References:
JP2013055277A2013-03-21
JP2004119560A2004-04-15
JP2002217268A2002-08-02
JP2012222231A2012-11-12
JP2014229702A2014-12-08
JP2013000748A2013-01-07
JP2018098363A2018-06-21
Attorney, Agent or Firm:
ITOH, Tadashige et al. (16th Floor, Marunouchi MY PLAZA 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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