Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/066492
Kind Code:
A1
Abstract:
Provided is a substrate processing system for processing a substrate, the system comprising: a separating section for separating the substrate into a first separated substrate and a second separated substrate, said separation starting from an internal plane modified layer formed in an in-plane direction of the interior of the substrate; a machining section for respectively grinding a separation surface of the first separated substrate and a separation surface of the second separated substrate; a conveyance mechanism for conveying the substrate to at least the separating section or the machining section; and an inversion mechanism for inverting the front and rear faces of the second separated substrate.
Inventors:
TANOUE HAYATO (JP)
Application Number:
PCT/JP2019/034565
Publication Date:
April 02, 2020
Filing Date:
September 03, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B23K26/53; H01L21/301; H01L21/683
Foreign References:
| JP2017092314A | 2017-05-25 | |||
| JP2017204606A | 2017-11-16 | |||
| JP2010021398A | 2010-01-28 | |||
| JP2016519433A | 2016-06-30 | |||
| JP2006179868A | 2006-07-06 | |||
| JP2016064459A | 2016-04-28 | |||
| JP2004111606A | 2004-04-08 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Download PDF: