Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/203205
Kind Code:
A1
Abstract:
This substrate processing system has at least one vacuum processing chamber, at least one vacuum heating chamber, a plurality of load lock chambers, a vacuum conveyance chamber, and at least one control unit. The plurality of load lock chambers have a first load lock chamber having a cooling mechanism. At least one control unit is structured to control the vacuum conveyance chamber so as to perform a plurality of conveyance cycles. Each conveyance cycle includes substrate conveyance from at least one vacuum processing chamber to at least one vacuum heating chamber, substrate conveyance from at least one vacuum heating chamber to the first load lock chamber, and substrate conveyance from the first load lock chamber to at least one vacuum processing chamber.
Inventors:
YAMAGUCHI HIROFUMI (JP)
NISHIMORI YUICHI (JP)
SASAKI YOSHIAKI (JP)
NISHIMORI YUICHI (JP)
SASAKI YOSHIAKI (JP)
Application Number:
PCT/JP2020/011324
Publication Date:
October 08, 2020
Filing Date:
March 16, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; H01L21/302; H01L21/677
Foreign References:
| JP2002158273A | 2002-05-31 | |||
| JP2010500734A | 2010-01-07 | |||
| JP2012138540A | 2012-07-19 | |||
| JP2004128022A | 2004-04-22 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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