Title:
SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/260128
Kind Code:
A1
Abstract:
The present invention proposes a substrate processing system, and a substrate processing method that can prevent deformation and contamination of a surface on the reverse side from a surface to be processed which is the object of processing. A substrate processing system for performing processing on a surface to be processed of a substrate, the substrate processing system comprising: a protective film formation unit for forming a protective film on a surface on the reverse side from the surface to be processed of the substrate; a substrate processing unit for performing processing on the surface to be processed of the substrate; and a protective film removing unit for removing the protective film from the surface on the reverse side of the substrate.
Inventors:
HAMADA SATOMI (JP)
Application Number:
PCT/JP2022/023278
Publication Date:
December 15, 2022
Filing Date:
June 09, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/00; B24B1/00; H01L21/02; H01L21/304; H01L21/683
Domestic Patent References:
| WO2018135492A1 | 2018-07-26 | |||
| WO2019082974A1 | 2019-05-02 |
Foreign References:
| JP2020061494A | 2020-04-16 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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