SUBSTRATE PROCESSING SYSTEM

WIPO Patent Application WO/2010/055851

A1

To provide a substrate processing system which can increase an interval between various processing devices connected to the side surface of a transfer module, exhibit an excellent maintenance property, avoid deterioration of the throughput, and assure a sufficient productivity. Provided is a substrate processing system for manufacturing an organic EL element by layering on a substrate, a plurality of layers including, for example, an organic layer.  A rectilinear carry path is configured by one or more transfer modules to be subjected to evacuation.  Inside the transfer modules are arranged a plurality of carry in/out areas for carrying the substrate into/out of the processing devices and one or more stock areas arranged therebetween.  The carry in/out areas and the stock areas are alternately arranged in series along the carry path.  The processing devices are connected, at the positions opposing to the carry in/out areas, to the side surface of the transfer module.

MATSUBAYASHI SHINJI (JP)
KAWAKAMI SATORU (JP)
TOBE YASUHIRO (JP)
NISHIMURA MASARU (JP)
YAGI YASUSHI (JP)
HAYASHI TERUYUKI (JP)
ONO YUJI (JP)
SHIMO FUMIO (JP)

PCT/JP2009/069196

May 20, 2010

November 11, 2009

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TOKYO ELECTRON LTD (JP)
MATSUBAYASHI SHINJI (JP)
KAWAKAMI SATORU (JP)
TOBE YASUHIRO (JP)
NISHIMURA MASARU (JP)
YAGI YASUSHI (JP)
HAYASHI TERUYUKI (JP)
ONO YUJI (JP)
SHIMO FUMIO (JP)

B65G49/06; H01L21/677; H01L51/50; H05B33/10

JP2006210371A	2006-08-10
JP2003059999A	2003-02-28
JP2007335203A	2007-12-27
JP2006330684A	2006-12-07

HAGIWARA, Yasushi et al. (JP)
Yasushi Hagiwara (JP)

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