Title:
SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/070127
Kind Code:
A1
Abstract:
[Problem] To perform plating processing immediately on a substrate on which plasma vacuum processing has been performed. [Solution] This substrate processing system 1 is provided with a chamber 1A, a plasma vacuum processing module 4 disposed inside the chamber 1A, a plating processing module 5, and a thermal processing module 6. A substrate W is conveyed between the plasma vacuum processing module 4, the plating processing module 5, and the thermal processing module 6 by means of a common conveyance mechanism 222.
Inventors:
IWASHITA MITSUAKI (JP)
Application Number:
PCT/JP2017/031025
Publication Date:
April 19, 2018
Filing Date:
August 29, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; B65G49/07; C23C18/16; C23C18/18; H01L21/28; H05H1/46
Foreign References:
| JP2009249679A | 2009-10-29 | |||
| JP2007109858A | 2007-04-26 | |||
| JPH07142549A | 1995-06-02 | |||
| JP2015035583A | 2015-02-19 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
Download PDF:
Previous Patent: GAS ENGINE SYSTEM
Next Patent: ANTENNA DEVICE, COMMUNICATION TERMINAL APPARATUS AND WRISTWATCH WITH CROWN
Next Patent: ANTENNA DEVICE, COMMUNICATION TERMINAL APPARATUS AND WRISTWATCH WITH CROWN