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Patent Searching and Data


Title:
SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/235581
Kind Code:
A1
Abstract:
The objective of the present invention is to enable a reduction in labor, energy, and/or cost pertaining to a substrate processing device. This substrate processing system is provided with a sensor which is installed in a substrate processing device to detect a target physical quantity during processing of a target substrate, and a predicting unit for outputting a polishing end point timing, which is the timing at which to terminate polishing, by inputting time-series data of the physical quantity detected by the sensor, or time-series data obtained by differentiating the time-series data of the physical quantity with respect to time, into a trained machine learning model, wherein the machine learning model is a model that has been subjected to machine learning using the time-series data of the physical quantity in the past, or the time-series data of the time-series data of the physical quantity in the past, differentiated with respect to time, as an input, and the polishing end point timing in the past as an output. 

Inventors:
TORIKOSHI TSUNEO (JP)
HATAKEYAMA MASAHIRO (JP)
NAKAGOMI RYO (JP)
Application Number:
PCT/JP2020/019869
Publication Date:
November 26, 2020
Filing Date:
May 20, 2020
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B37/013; H01L21/304
Foreign References:
JP2009004442A2009-01-08
US20190143474A12019-05-16
JP2018058197A2018-04-12
JP2000202768A2000-07-25
JP2004025057A2004-01-29
JP2020053550A2020-04-02
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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