Title:
SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/071130
Kind Code:
A1
Abstract:
The disclosed substrate processing system includes a vacuum transfer chamber, a plurality of substrate processing modules, a ring stocker, a transfer robot, and a control unit. The plurality of substrate processing modules and the ring stocker are connected to the vacuum transfer chamber. When the transfer robot is using at one of at least two end effectors to transfer only a new edge ring, the control unit controls the transfer robot in response to a substrate transfer request so as to transfer a substrate through the vacuum transfer chamber by using an end effector from among the at least two end effectors that is not being used by the transfer robot.
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Inventors:
OKAMURA TATSURU (JP)
KITA MASATOMO (JP)
SONG YOUNG TAE (JP)
KITA MASATOMO (JP)
SONG YOUNG TAE (JP)
Application Number:
PCT/JP2023/034968
Publication Date:
April 04, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; H01L21/3065; H05H1/46
Foreign References:
| JP2020096149A | 2020-06-18 | |||
| JP2022117671A | 2022-08-12 | |||
| JP2022050314A | 2022-03-30 | |||
| JP2022033699A | 2022-03-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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