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Title:
SUBSTRATE SPLITTING APPARATUS, SUBSTRATE SPLITTING METHOD, AND SPLIT SUBSTRATE SPLIT BY USING THE APPARATUS OR METHOD
Document Type and Number:
WIPO Patent Application WO/2007/142264
Kind Code:
A1
Abstract:
Provided are a substrate splitting apparatus and a substrate splitting method, which can improve a production efficiency and can reduce a load on a substrate to be split. The substrate splitting apparatus (10) is characterized to comprise scribe line forming means (40, 50) for forming a scribe line (SB) on a split-scheduled line (J) in a substrate (K) to be split, and bending moment applying means (60, 90) for applying, following the formation of the scribe line (SB) by the scribe line forming means (40, 50), a bending moment of such a magnitude to the substrate (K) as can split the substrate (K) across the scribe line (SB).

Inventors:
UCHIKATA, Tomoo (C/O TORAY ENGINEERING CO. LTD, 1-45, Oe 1-chom, Otsu-shi Shiga 41, 5202141, JP)
内潟 外茂夫 (〒41 滋賀県大津市大江1丁目1番45号 東レエンジニアリング株式会社内 Shiga, 5202141, JP)
UEHARA, Yukihiro (C/O TORAY ENGINEERING CO. LTD, 1-45, Oe 1-chom, Otsu-shi Shiga 41, 5202141, JP)
Application Number:
JP2007/061453
Publication Date:
December 13, 2007
Filing Date:
June 06, 2007
Export Citation:
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Assignee:
TORAY ENGINEERING CO., LTD. (Nihonbashi Muromachi Bldg, 3-3-16 Nihonbashi-Hongokucho, Chuo-k, Tokyo 21, 1030021, JP)
東レエンジニアリング株式会社 (〒21 東京都中央区日本橋本石町3丁目3番16号(日本橋室町ビル) Tokyo, 1030021, JP)
UCHIKATA, Tomoo (C/O TORAY ENGINEERING CO. LTD, 1-45, Oe 1-chom, Otsu-shi Shiga 41, 5202141, JP)
内潟 外茂夫 (〒41 滋賀県大津市大江1丁目1番45号 東レエンジニアリング株式会社内 Shiga, 5202141, JP)
International Classes:
B28D5/00; C03B33/033; C03B33/09
Domestic Patent References:
2004-01-22
Foreign References:
JPH10338534A1998-12-22
JPH11171573A1999-06-29
JP2005262727A2005-09-29
JP3810127B22006-08-16
JPH07164400A1995-06-27
JP2003261345A2003-09-16
JP3199074B22001-08-13
JPH06102480A1994-04-15
JPH07276174A1995-10-24
Attorney, Agent or Firm:
TSUGAWA, Tomoo (Lions Mansion Noe No. 1201, 7-7 Chuo 2-chome,Joto-ku, Osaka-shi, Osaka, 536-0005, JP)
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