Description

SUBSTRATE STRUCTURE AND PROBE CARD HAVING THE

SAME

Technical Field

[1] Example embodiments of the present invention relate to a substrate structure and a probe card having the same, and more particularly, relate to a substrate structure including a probe making direct contact with an inspection object and a probe card including the same. Background Art

[2] Semiconductor devices are generally manufactured through a series of unit processes such as a fab process, an electrical die sorting (EDS) process and a packaging process. Various electric circuits and devices are fabricated on a semiconductor substrate such as a silicon wafer in the fab process, and electrical characteristics of the electric circuits are inspected and defective chips are detected in the wafer in the EDS process. Then, the devices are individually separated from the wafer and each device is sealed in an epoxy resin and packaged into an individual semiconductor device in the packaging process.

[3] A repairable defective chip is regenerated in a repair process and an irreparable defective chip is removed from the wafer prior to an assembly process of the packaging process. Therefore, the EDS process significantly reduces the cost of the assembly process and increases production yields of semiconductor devices. A well- known apparatus for the EDS process includes a probe card in which a plurality of probes is installed. Each of the probes makes contact with a conductive pad of an inspection object, such as a wafer, and detects electrical signals from the inspection object.

[4] The probe card includes a first substrate structure, a second substrate structure and a connector connecting the first and second substrate structures. The first substrate structure includes a connection hole, and the second substrate structure includes a contact pad on an upper surface and a plurality of probes, making direct contact with the inspection object, on a lower surface. A conductive layer is located on an inner surface of the connection hole, and a signal line in the first substrate structure is electrically connected to the conductive layer.

[5] FIG. 1 is a cross-sectional view illustrating a second substrate structure of a conventional probe card.

[6] Referring to FIG. 1, a second substrate structure 1 of the conventional probe card includes a substrate 10, a contact pad 20 positioned on an upper surface of the substrate

10, a probe 30 and a capacitor 40 positioned on a lower surface of the substrate 10, a signal line 50 through which the contact pad 20, the probe 30 and the capacitor 40 are electrically connected with one another, and a ground line 60 for grounding the capacitor. The probe 30 and the capacitor 40 are electrically connected with each other in parallel.

[7] The capacitor 40 includes a first electrode 42 connected to the signal line 50, a second electrode 44 connected to the ground line 60 and a dielectric unit 46 interposed between the first and second electrodes 42 and 44. The capacitor 40 grounds noise or distorted signals in an electrical signal transferred to the inspection object through the probe 30, to thereby remove the noise or distorted signals from the electrical signal. Further, when input power is insufficiently applied to the inspection object, the capacitor may also provide supplementary power to the inspection object for compensating for the shortage of the input power.

[8] When the electrical signal including the noise and signal distortion is a low frequency signal of which the speed is smaller than the operation speed of the capacitor 40, the capacitor 40 sufficiently removes the noise or distorted signals from the electrical signal. In contrast, when the electrical signal including the noise and signal distortion is a high frequency signal of which the speed is greater than the operation speed of the capacitor 40, the capacitor 40 may not be able to remove the noise or distorted signals from the electrical signal, because the probe 30 and the capacitor 40 are connected with each other in parallel. Accordingly, when the electrical signal is a high frequency signal, there is a problem in that the noise and signal distortion may be transferred to the inspection object through the probe 30.

[9] In addition, while the conventional substrate structure 1 includes a plurality of contact pads 20 and a plurality of probes 30 on the substrate 10, the signal line 50 connects only one contact pad 20 and one probe 30. Thus, the signal line 50 may become very complicated in the substrate 10. Accordingly, there may be many difficulties in designing the signal line and manufacturing the substrate structure 1. Disclosure of Invention Technical Problem

[10] Accordingly, the present invention provides a substrate structure for sufficiently removing noise and signal distortion from a high frequency signal applied to an inspection object.

[11] The present invention also provides a probe card including the above substrate structure. Technical Solution

[12] According to an aspect of the present invention, there is provided a substrate

structure comprising a substrate, a contact pad positioned on an upper surface of the substrate and transferring an input or output signal, a probe positioned on a lower surface of the substrate and making contact with an inspection object, a capacitor positioned on the substrate and including a first electrode, a second electrode and a dielectric unit interposed between the first and second electrodes, a first signal line electrically connecting the contact pad and the first electrode of the capacitor, and a second signal line electrically connecting the probe and the first electrode of the capacitor.

[13] In an example embodiment, the substrate structure may further comprise a ground line electrically connected to the second electrode of the capacitor for electrically grounding the capacitor, so that the capacitor is grounded.

[14] In an example embodiment, the first electrode of the capacitor is electrically connected to a plurality of the first signal lines and / or to a plurality of the second signal lines.

[15] In an example embodiment, the first electrode of the capacitor is electrically connected to the single first signal line and to the single second signal line.

[16] In an example embodiment, the capacitor is positioned on the upper surface of the substrate or on the lower surface of the substrate.

[17] In an example embodiment, the capacitor is positioned inside the substrate.

[18] According to another aspect of the present invention, there is provided a substrate structure comprising a substrate, a contact pad positioned on an upper surface of the substrate and transferring an input or output signal, a probe positioned on a lower surface of the substrate and making contact with an inspection object, a signal line connecting the contact pad and the probe, and a capacitor including a first electrode, a second electrode and a dielectric unit interposed between the first and second electrodes, the first electrode being electrically connected to the signal line in series.

[19] In an example embodiment, the substrate structure may further comprise a ground line electrically connected to the second electrode of the capacitor for electrically grounding the capacitor, so that the capacitors electrically grounded.

[20] In an example embodiment, the first electrode of the capacitor is electrically connected to a plurality of the signal lines in series.

[21] In an example embodiment, the capacitor is positioned on the lower surface of the substrate or on the upper surface of the substrate.

[22] In an example embodiment, the capacitor is positioned inside the substrate.

[23] According to still another aspect of the present invention, there is provided a substrate structure comprising a substrate, a contact pad positioned on an upper surface of the substrate, a plurality of probes positioned on a lower surface of the substrate and making contact with at least one inspection object, a first signal line connected to the

contact pad and penetrating through the substrate, and a plurality of second signal lines diverged from the first signal line and connected to a plurality of the probes.

[24] In an example embodiment, an input signal is transferred through the contact pad.

Power may be supplied through the contact pad, and a driving signal may be transferred through the contact pad. In addition, a ground signal may also be transferred through the contact pad.

[25] In an example embodiment, the second signal line is electrically connected to a plurality of the probes that make contact with the same inspection object or different inspection objects.

[26] According to further still another aspect of the present invention, there is provided a substrate structure comprising a substrate, a plurality of contact pads positioned on an upper surface of the substrate, a plurality of probes positioned on a lower surface of the substrate and making contact with at least one inspection object, a first signal line connected to the contact pad and penetrating through the substrate, and at least one second signal line for connecting a plurality of the probes to the first signal line that is electrically connected to the contact pad for receiving an input signal and for connecting the probe to the first signal line that is electrically connected to the contact pad for receiving an output signal.

[27] According to further still another aspect of the present invention, there is provided a substrate structure comprising a substrate, a contact pad positioned on an upper surface of the substrate, a plurality of probes positioned on a lower surface of the substrate and making contact with at least one inspection object, a first signal line connected to the contact pad and penetrating through the substrate, a plurality of second signal lines diverged from the first signal line and connected to a plurality of the probes, and a capacitor including a first electrode, a second electrode and a dielectric unit interposed between the first and second electrodes, the first electrode being connected to the first signal line in series.

[28] In an example embodiment, the substrate structure may further include a ground line electrically connected to the second electrode of the capacitor, so that the capacitor is grounded through the ground line.

[29] In an example embodiment, the capacitor is positioned on an upper surface or a lower surface of the substrate.

[30] In an example embodiment, the capacitor may be positioned inside the substrate.

[31] In an example embodiment, an input signal is transferred through the contact pad, or power is supplied through the contact pad. In addition, a driving signal or a ground signal may be transferred through the contact pad.

[32] In an example embodiment, the second signal line is electrically connected to a plurality of the probes that make contact with the same inspection object or with

different inspection objects.

[33] According to further still another aspect of the present invention, there is provided a substrate structure comprising a substrate, a plurality of contact pads positioned on an upper surface of the substrate, a plurality of probes positioned on a lower surface of the substrate and making contact with at least one inspection object, a first signal line connected to the contact pad and penetrating through the substrate, at least one second signal line for connecting a plurality of the probes to the first signal line that is electrically connected to the contact pad for receiving an input signal and for connecting the probe to the first signal line that is electrically connected to the contact pad for receiving an output signal, and a capacitor including a first electrode, a second electrode and a dielectric unit interposed between the first and second electrodes, the first electrode being connected to the first signal line in series.

[34] According to an aspect of the present invention, there is provided a probe card comprising a first substrate structure including an inner circuit, a second substrate structure and at least one connector electrically connecting the first substrate structure and the second substrate structure. The second substrate structure may include a substrate, a contact pad positioned on an upper surface of the substrate and transferring input and output signals, a probe positioned on a lower surface of the substrate and making contact with at least one inspection object, a capacitor having a first electrode, a second electrode and a dielectric unit interposed between the first and second electrodes, a first signal line electrically connecting the contact pad to the first electrode of the capacitor and a second signal line electrically connecting the first electrode of the capacitor to the probe.

[35] According to another aspect of the present invention, there is provided a probe card comprising a first substrate structure including an inner circuit, a second substrate structure and at least one connector electrically connecting the first substrate structure and the second substrate structure. The second substrate structure may include a substrate, a contact pad positioned on an upper surface of the substrate and transferring input and output signals, a probe positioned on a lower surface of the substrate and making contact with at least one inspection object, a signal line electrically connecting the contact pad and the probe and a capacitor having a first electrode, a second electrode and a dielectric unit interposed between the first and second electrodes, the first electrode of the capacitor being electrically connected to the signal line.

[36] According to still another aspect of the present invention, there is provided a probe card comprising a first substrate structure including an inner circuit, a second substrate structure and at least one connector electrically connecting the first substrate structure and the second substrate structure. The second substrate structure may include a substrate, a contact pad positioned on an upper surface of the substrate, a plurality of

probes positioned on a lower surface of the substrate and making contact with at least one inspection object, a first signal line penetrating the substrate and a plurality of second signal lines diverging from the first signal line and electrically connected to a plurality of the probes.

[37] According to further still another aspect of the present invention, there is provided a probe card comprising a first substrate structure including an inner circuit, a second substrate structure and at least one connector electrically connecting the first substrate structure and the second substrate structure. The second substrate structure may include a substrate, a plurality of contact pads positioned on an upper surface of the substrate, a plurality of probes positioned on a lower surface of the substrate and making contact with at least one inspection object, a first signal line connected to the contact pad and penetrating through the substrate, and at least one second signal line for connecting a plurality of the probes to the first signal line that is electrically connected to the contact pad for receiving an input signal and for connecting the probe to the first signal line that is electrically connected to the contact pad for receiving an output signal.

[38] According to further still another aspect of the present invention, there is provided a probe card comprising a first substrate structure including an inner circuit, a second substrate structure and at least one connector electrically connecting the first substrate structure and the second substrate structure. The second substrate structure may include a substrate, a contact pad positioned on an upper surface of the substrate, a plurality of probes positioned on a lower surface of the substrate and making contact with at least one inspection object, a first signal line connected to the contact pad and penetrating through the substrate, a plurality of second signal lines diverged from the first signal line and connected to a plurality of the probes, and a capacitor including a first electrode, a second electrode and a dielectric unit interposed between the first and second electrodes, the first electrode being connected to the first signal line in series.

[39] According to further still another aspect of the present invention, there is provided a probe card comprising a first substrate structure including an inner circuit, a second substrate structure and at least one connector electrically connecting the first substrate structure and the second substrate structure. The second substrate structure may include a substrate, a plurality of contact pads positioned on an upper surface of the substrate, a plurality of probes positioned on a lower surface of the substrate and making contact with at least one inspection object, a first signal line connected to the contact pad and penetrating through the substrate, at least one second signal line for connecting a plurality of the probes to the first signal line that is electrically connected to the contact pad for receiving an input signal and for connecting the probe to the first signal line that is electrically connected to the contact pad for receiving an output

signal, and a capacitor including a first electrode, a second electrode and a dielectric unit interposed between the first and second electrodes, the first electrode being connected to the first signal line in series.

Advantageous Effects

[40] According to example embodiments of the present invention, a first electrode of a capacitor is electrically connected to a probe in series, so that noise and signal distortion in a high frequency signal, as well as those in a low frequency signal, may be grounded by the capacitor through a ground line, to thereby sufficiently prevent the noise and signal distortion in the high frequency signal. In addition, a signal line connected to a contact pad for receiving an input signal may be diverged into a plurality of diverging lines at a lower surface of a substrate and the diverging lines may be electrically connected to a plurality of the probes, thereby decreasing the number of the signal lines and facilitating the design and formation of the signal lines inside the substrate. Brief Description of the Drawings

[41] The above and other features and advantages of the invention will become readily apparent by reference to the following detailed description when considered in conjunction with the accompanying drawings wherein:

[42] FIG. 1 is a cross-sectional view illustrating a second substrate structure of a conventional probe card ;

[43] FIG. 2 is a cross-sectional view illustrating a substrate structure in accordance with an example embodiment of the present invention;

[44] FIG. 3 is a cross-sectional view illustrating a substrate structure in accordance with another example embodiment of the present invention;

[45] FIG. 4 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention;

[46] FIG. 5 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention;

[47] FIG. 6 is a bottom view illustrating a bottom portion of the substrate structure shown in FIG. 5;

[48] FIG. 7 is a view illustrating an interconnection of the substrate structures shown in

FIG. 5;

[49] FIG. 8 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention;

[50] FIG. 9 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention;

[51] FIG. 10 is a cross-sectional view illustrating a substrate structure in accordance with

still another example embodiment of the present invention; and

[52] FIG. 11 is a cross-sectional view illustrating a probe card in accordance with still another example embodiment of the present invention. Best Mode for Carrying Out the Invention

[53] The invention is described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[54] It will be understood that when an element or layer is referred to as being "on,"

"connected to" or "coupled to" another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[55] It will be understood that, although the terms first, second, third etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.

[56] Spatially relative terms, such as "beneath," "below," "lower," "above," "upper" and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein in-

terpreted accordingly.

[57] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[58] Embodiments of the invention are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments of the invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and / or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the invention.

[59] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[60] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[61] FIG. 2 is a cross-sectional view illustrating a substrate structure in accordance with an example embodiment of the present invention.

[62] Referring to FIG. 2, the substrate structure 100 of the present example embodiment includes a substrate 110, a contact pad 120, a probe 130, a capacitor 140, a first signal line 150, a second signal line 160 and a ground line 170.

[63] In an example embodiment, the substrate 110 may have a disk shape.

[64] In an example embodiment, a plurality of the contact pads 120 is positioned on an upper surface of the substrate 110, and the contact pad 120 may comprise a conductive material.

[65] In an example embodiment, a plurality of the probes 130 is positioned on a lower surface of the substrate 110. The probe 130 may be manufactured independently from the bottom substrate 110, and may be installed onto the lower surface of the substrate 110. Otherwise, the probe 130 may be formed on the lower surface of the substrate 110 in one body. While the present example embodiment discloses a cantilever-type probe as shown in FIG. 2, a vertical type or any other configuration known to one of ordinary skill in the art may also be utilized in place of or in conjunction with the cantilever type.

[66] In an example embodiment, the capacitor 140 includes first and second electrodes

142 and 144 and a dielectric unit 146 interposed between the first and second electrodes 142 and 144.

[67] In an example embodiment, the first signal line 150 is positioned inside the substrate

110, and electrically connects the contact pad 120 and the first electrode 142 of the connector 140. Particularly, the first signal line 150 includes a multilayer wiring and a via through which the multiple layers of the wiring are interconnected with one another.

[68] The second signal line 160 is positioned on a lower surface of the substrate 110, and electrically connects the first electrode 142 of the capacitor 140 and the probe 130. Particularly, the second signal line 160 may include a wiring on the lower surface of the substrate 110. In the present embodiment, the first electrode 142 of the capacitor 140 may be connected one-to-one to the probe 130 through the second signal line 160. However, the first electrode 142 of the capacitor 140 may be connected one-to-many to the probe 130 through the second signal line 160, as would be known to one of ordinary skill in the art. That is, the first electrode 142 of the capacitor 140 may be connected to a plurality of the probes 130 through the second signal line 160.

[69] The ground line 170 is electrically connected to the second electrode 144 of the capacitor 140.

[70] For example, the first electrode 142 of the capacitor 140 may be located on an electrical path connecting the contact pad 120 and the probe 130 by the first and second signal lines 150 and 160. The first electrode 142 of the capacitor 140 is electrically connected to the probe 130 in series, so that the electrical signal to the inspection object necessarily passes through the capacitor 140. As a result, the noise and signal distortion in a high frequency signal, as well as those in a low frequency signal, may be grounded by the capacitor 140 through the ground line 170, to thereby sufficiently prevent the noise and signal distortion in the high frequency signal. Ac-

cordingly, the electrical signal without the noise and signal distortion is applied to the inspection object. In addition, when input power is insufficiently applied to the inspection object, the capacitor may also compensate for the shortage of the input power, to thereby prevent an inspection failure of the inspection object caused by the power shortage.

[71] FIG. 3 is a cross-sectional view illustrating a substrate structure in accordance with another example embodiment of the present invention.

[72] Referring to FIG. 3, the substrate structure 200 of the present example embodiment includes a substrate 210, a contact pad 220, a probe 230, a capacitor 240, a first signal line 250, a second signal line 260 and a ground line 270.

[73] The substrate 210, the contact pad 220 and the probe 230 have substantially the same structure as the substrate 110, the contact pad 120 and the probe 130 of the substrate structure 100 that are described with reference to FIG. 2, so that further detailed descriptions of the substrate 310, the contact pad 320 and the probe 330 are omitted hereinafter.

[74] In an example embodiment, the capacitor 240 includes first and second electrodes

242 and 244 and a dielectric unit 246 interposed between the first and second electrodes 242 and 244. The capacitor 240 is positioned at a lower surface of the substrate 210.

[75] The first signal line 250 is positioned on an upper surface of the substrate 210, and electrically connects the contact pad 220 and the first electrode 242 of the connector 240. Particularly, the first signal line 250 includes a wiring positioned on the upper surface of the substrate 210.

[76] The second signal line 260 is positioned inside the substrate 210 and / or a lower surface of the substrate 210, and electrically connects the first electrode 242 of the capacitor 240 and the probe 230. Particularly, the second signal line 260 inside the substrate 210 includes a multilayer wiring and a via through which the multiple layers of the wiring are interconnected with one another, and the second signal line 260 on the lower surface of the substrate 210 includes a wiring.

[77] In an example embodiment, the first electrode 242 of the capacitor 240 may be connected one-to-one to the probe 230 through the second signal line 260. That is, the first electrode 242 of the capacitor 240 may be electrically connected to one probe 230. However, the first electrode 242 of the capacitor 240 may be connected one-to-many to the probe 230 through the second signal line 260, as would be known to one of ordinary skill in the art. That is, the first electrode 242 of the capacitor 240 may be connected to a plurality of the probes 230 through the second signal line 260. Particularly, when the second signal line 260 is positioned both inside the substrate 210 and on the lower surface of the substrate 210, a single line is used as the second signal

line 260 inside the substrate 210 and a plurality of diverging lines that are diverged from the single line are used as the second signal line 260 at the lower surface of the substrate 210, because the lower surface of the substrate 210 is much more favorable than the inside of the substrate 210 for forming the second signal line 260. The diverging lines at the lower surface of the substrate 210 are electrically connected to a plurality of the probes 230, respectively.

[78] FIG. 4 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention.

[79] Referring to FIG. 4, the substrate structure 300 of the present example embodiment includes a substrate 310, a contact pad 320, a probe 330, a capacitor 340, a first signal line 350, a second signal line 360 and a ground line 370.

[80] The substrate 310, the contact pad 320 and the probe 330 have substantially the same structure as the substrate 110, the contact pad 120 and the probe 130 of the substrate structure 100 that are described with reference to FIG. 2, so that further detailed descriptions of the substrate 310, the contact pad 320 and the probe 330 are omitted hereinafter.

[81] In an example embodiment, the capacitor 340 includes first and second electrodes

342 and 344 and a dielectric unit 346 interposed between the first and second electrodes 342 and 344. The capacitor 340 is positioned inside the substrate 310.

[82] The first signal line350 is positioned inside the substrate 310, and electrically connects the contact pad 320 and the first electrode 342 of the connector 340. Particularly, the first signal line 350 includes a multilayer wiring and a via through which the multiple layers of the wiring are interconnected with one another.

[83] The second signal line 360 is positioned inside the substrate 310 and / or a lower surface of the substrate 310, and electrically connects the first electrode 342 of the capacitor 340 and the probe 330. Particularly, the second signal line 360 inside the substrate 310 includes a multilayer wiring and a via through which the multiple layers of the wiring are interconnected with one another, and the second signal line 360 on the lower surface of the substrate 310 includes a wiring.

[84] In an example embodiment, the first electrode 342 of the capacitor 340 may be connected one-to-one to the probe 330 through the second signal line 360. That is, the first electrode 342 of the capacitor 340 may be electrically connected to one probe 330. However, the first electrode 342 of the capacitor 340 may be connected one-to-many to the probe 330 through the second signal line 360, as would be known to one of ordinary skill in the art. That is, the first electrode 342 of the capacitor 340 may be connected to a plurality of the probes 330 through the second signal line 360. Particularly, when the second signal line 360 is positioned both inside the substrate 310 and on the lower surface of the substrate 310, a single line is used as the second signal

line 360 inside the substrate 310 and a plurality of diverging lines that are diverged from the single line are used as the second signal line 360 at the lower surface of the substrate 310, because the lower surface of the substrate 310 is much more favorable than the inside of the substrate 310 for forming the second signal line 260. The diverging lines at the lower surface of the substrate 310 are electrically connected to a plurality of the probes 330, respectively.

[85] FIG. 5 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention. FIG. 6 is a bottom view illustrating a bottom portion of the substrate structure shown in FIG. 5, and FIG. 7 is a view illustrating an interconnection of the substrate structures shown in FIG. 5.

[86] Referring to FIGS. 5 to 7, the substrate structure 400 of the present example embodiment includes a substrate 410, a contact pad 420, a probe 430, a first signal line 450, and a second signal line 460.

[87] In an example embodiment, the substrate 410 may have a disk shape.

[88] In an example embodiment, a plurality of the contact pads 420 is positioned on an upper surface of the substrate 410, and the contact pad 420 may comprise a conductive material.

[89] In an example embodiment, a plurality of the probes 430 is positioned on a lower surface of the substrate 410. The probe 430 may be manufactured independently from the bottom substrate 410, and may be installed onto the lower surface of the substrate 410. Otherwise, the probe 430 may be formed on the lower surface of the substrate 410 in one body. While the present example embodiment discloses a cantilever-type probe as shown in FIG. 5, a vertical type or any other configuration known to one of ordinary skill in the art may also be utilized in place of or in conjunction with the cantilever type.

[90] In an example embodiment, the first signal line 450 is positioned inside the substrate

410 and is electrically connected to the contact pad 420. In the present embodiment, the first signal line 450 is extended to a lower surface of the substrate 410. Particularly, the first signal line 450 includes a multilayer wiring and a via through which the multiple layers of the wiring are interconnected with one another.

[91] The second signal line 460 is positioned on the lower surface of the substrate 410, and electrically connects the first signal line 450 and the probe 430. Particularly, the second signal line 460 may include a wiring on the lower surface of the substrate 410.

[92] When the contact pad 420 connected to the first signal line 450 is an input pad for receiving an input signal, the first signal line 450 is electrically connected to a plurality of the probes 430 through the second signal line 460. The input pad only transfers the input signal to a semiconductor device through the probe 430, and does not transfer an output signal from the semiconductor device. That is, a plurality of the second signal

lines 460 may be diverged from the first signal line 450 and electrically connected to a plurality of the probes 430. In the present embodiment, the second signal line 460 is connected to a plurality of the probes 430 that make contact with the same inspection object, as shown in FIG. 7. In FIG. 7, the dotted line indicates the probes making contact with the same inspection object. Otherwise, the second signal line 460 may be connected to a plurality of the probes 430 that make contact with at least two inspection objects different from one another.

[93] When the contact pad 420 connected to the first signal line 450 is an output pad for receiving an output signal, the first signal line 450 is electrically connected one-to-one to the probes 430 through the second signal line 460, though not shown in figures. The output pad transfers an output signal from the semiconductor device as well as an input signal to a semiconductor device through the probe 430. That is, the second signal lines 460 may electrically connect one-to-one the first signal line 450 and the probe 430.

[94] Accordingly, the first signal line 450, which is connected to the input pad, is electrically connected to a plurality of the probes 430, thereby decreasing the number of the first signal lines 450 and facilitating the design and formation of the first signal lines 450 inside the substrate 410. Although the number of the second signal lines 460 is not decreased, the second signal line 460 may be more easily formed on the substrate 410 because the second signal line 460 is positioned at a lower surface of the substrate 410. FIG. 8 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention.

[95] Referring to FIG. 8, the substrate structure 500 of the present example embodiment includes a substrate 510, a contact pad 520, a probe 530, capacitor 540, a first signal line 550, a second signal line 560 and a ground line 570.

[96] The substrate 510, the contact pad 520, the probe 530 and the first and second signal lines 550 and 560 have substantially the same structure as the substrate 410, the contact pad 420, the probe 430 and the first and second signal lines 450 and 460 of the substrate structure 400 that are described with reference to FIGS. 5 to 7, so that further detailed descriptions of the substrate 510, the contact pad 520 and the probe 530 and the first and second signal lines 550 and 560 are omitted hereinafter.

[97] The capacitor 540 includes first and second electrodes 542 and 544 and a dielectric unit 546 interposed between the first and second electrodes 542 and 544. The capacitor 540 is positioned on a lower surface of the substrate 510. The first electrode 542 of the capacitor 540 is electrically connected to the first and second signal lines 550 and 560.

[98] The ground line 570 is electrically connected to the second electrode 544 of the capacitor 540.

[99] Accordingly, the first electrode 542 of the capacitor 540 is located on an electrical path connecting the contact pad 520 and the probe 530 by the first and second signal

lines 550 and 560. The first electrode 542 of the capacitor 540 is electrically connected to the probe 530 in series, so that the electrical signal to the inspection object necessarily passes through the capacitor 540. As a result, the noise and signal distortion in a high frequency signal, as well as those in a low frequency signal, may be grounded by the capacitor 540 through the ground line 570, to thereby sufficiently prevent the noise and signal distortion in the high frequency signal. Accordingly, the electrical signal without the noise and signal distortion is applied to the inspection object. In addition, when input power is insufficiently applied to the inspection object, the capacitor may also compensate for the shortage of the input power, to thereby prevent an inspection failure of the inspection object caused by the power shortage.

[100] Further, the first signal line 550, which is connected to the input pad, is electrically connected to a plurality of the probes 530, thereby decreasing the number of the first signal lines 550 and facilitating the design and formation of the first signal lines 550 inside the substrate 510. Although the number of the second signal lines 560 is not decreased, the second signal line 560 may be more easily formed on the substrate 510 because the second signal line 560 is positioned at a lower surface of the substrate 510.

[101] FIG. 9 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention.

[102] Referring to FIG. 9, the substrate structure 600 includes a substrate 610, a contact pad 620, a probe 630, a capacitor 640, a first signal line 650, a second signal line 660 and a ground line 670.

[103] The substrate 610, the contact pad 620, the probe 630 and the first and second signal lines 650 and 660 have substantially the same structure as the substrate 510, the contact pad 520, the probe 530 and the first and second signal lines 550 and 560 of the substrate structure 500 that are described with reference to FIG. 8, so that further detailed descriptions of the substrate 610, the contact pad 620 and the probe 630 and the first and second signal lines 650 and 660 are omitted hereinafter.

[104] The capacitor 640 includes first and second electrodes 642 and 644 and a dielectric unit 646 interposed between the first and second electrodes 642 and 644. The capacitor 640 is positioned on an upper surface of the substrate 610. The first electrode 642 of the capacitor 640 is positioned on the first signal line 650. That is, the first electrode 642 of the capacitor 640 may be electrically connected to the first signal line 650, and is extended to a lower surface of the substrate 610.

[105] FIG. 10 is a cross-sectional view illustrating a substrate structure in accordance with still another example embodiment of the present invention.

[106] Referring to FIG. 10, the substrate structure 700 includes a substrate 710, a contact pad 720, a probe 730, a capacitor 740, a first signal line 750, a second signal line 760 and a ground line 770.

[107] The substrate 710, the contact pad 720, the probe 730 and the first and second signal lines 750 and 760 have substantially the same structure as the substrate 510, the contact pad 520, the probe 530 and the first and second signal lines 550 and 560 of the substrate structure 500 that are described with reference to FIG. 8, so that further detailed descriptions of the substrate 710, the contact pad 720 and the probe 730 and the first and second signal lines 750 and 760 are omitted hereinafter.

[108] The capacitor 740 includes first and second electrodes 742 and 744 and a dielectric unit 746 interposed between the first and second electrodes 742 and 744. The capacitor 740 is positioned inside the substrate 710. The first electrode 742 of the capacitor 740 is positioned on the first signal line 750. That is, the first electrode 742 of the capacitor 740 may be electrically connected to the first signal line 750, and is extended to a lower surface of the substrate 710.

[109] FIG. 11 is a cross-sectional view illustrating a probe card in accordance with still another example embodiment of the present invention.

[110] Referring to FIG. 11, the probe card 800 includes a first substrate structure 810, a second substrate structure 820, a connector 830, a securing member 840 and a horizontal level-adjusting member 850.

[I l l] The first substrate structure 810 includes signal lines (not shown) positioned inside thereof, and a plurality of connection holes 812 penetrates through the substrate structure 810. The signal line is connected to the connection hole 812. A conductive layer (not shown) is formed on an inner surface of the connection hole 812. An addition tester (not shown) is electrically connected to the signal line.

[112] The second substrate structure 820 is positioned below the first substrate structure 810, and includes a substrate, a contact pad, a probe, a capacitor, a first signal line, a second signal line and a ground line.

[113] The second substrate structure 820 has substantially the same structure as the substrate structure 100 described in detail with reference to FIG. 2, so that further detailed description of the second substrate structure 820 is omitted hereinafter.

[114] While the above example embodiment discusses the substrate structure in FIG. 2 as the second substrate structure 820, the substrate structures shown in FIGS. 3 to 10 may also be used as the second substrate of the probe card 800, as would be known to one of the ordinary skill in the art.

[115] The connector 830 may be inserted into the connection hole 812 of the first substrate structure 810 and may be electrically connected to the contact pad of the second substrate structure 820. For example, the connector 830 may comprise a conductive material such as a metal. The connector 830 may include an elastic portion for absorbing an external force between the first and second substrate structures 810 and 820.

[116] The securing member 840 may include a first plate 841, a second plate 842, a third plate 843, a leaf spring 844 and a plurality of bolts (not shown), and secures the first and second substrate structure to each other.

[117] The first plate 841 is shaped into a disk, and is positioned on an upper surface of the first substrate structure 810. The second plate 842 is shaped into a ring, and is positioned at a peripheral portion of a lower surface of the first substrate structure 810. The first plate 841, the first substrate structure 810 and the second plate 842 are secured to one another by a first bolt 845. The third plate 843 is shaped into a ring smaller than the second plate 842, and surrounds a sidewall of the second substrate structure 820. The leaf spring 844 makes contact with the second and third plates 842 and 843. The second plate 842 and the leaf spring 844 are secured to each other by a second bolt 846, and the third plate 843 and the leaf spring 844 are secured to each other by a third bolt 847.

[118] The horizontal level-adjusting member 850 penetrates the first plate 841 and the first substrate structure 810, and makes contact with an upper surface of the second substrate structure 820. When a thickness of the substrate of the second substrate structure 820 is varied in a longitudinal direction, the probes may not be positioned at the same level even though the first and second substrate structures810 and 820 are positioned at the same level. The horizontal level-adjusting member 850 controls an external force applied to the upper surface of the second substrate structure 820 in such a manner that the tips of the probes are positioned at the same level, to thereby control the horizontal level of the lower surface of the second substrate structure 820. Industrial Applicability

[119] According to example embodiments of the present invention, a capacitor is electrically connected to a signal line, which may electrically connect a contact pad and a probe in a substrate structure, in series. As a result, noise and signal distortion in a high frequency signal, as well as those in a low frequency signal, may be grounded by the capacitor through a ground line, to thereby sufficiently prevent the noise and signal distortion in the high frequency signal. Accordingly, an electrical signal without the noise and signal distortion is applied to an inspection object. In addition, when input power is insufficiently applied to the inspection object, the capacitor may also compensate for the shortage of the input power, to thereby prevent an inspection failure of the inspection object caused by the power shortage and to improve inspection reliability of the probe card.

[120] The signal line, which is connected to a contact pad for receiving an input signal, may be diverged into a plurality of diverging lines at a lower surface of a substrate and the diverging lines are electrically connected to a plurality of the probes, thereby de-

creasing the number of the signal lines and facilitating the design and formation of the signal lines inside the substrate. Therefore, the substrate structure may be manufactured with high efficiency. Although the exemplary embodiments of the present invention have been described, it is understood that the present invention should not be limited to these exemplary embodiments but various changes and modifications can be made by one skilled in the art within the spirit and scope of the present invention as hereinafter claimed.