Title:
SUBSTRATE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/049922
Kind Code:
A1
Abstract:
The present invention provides a substrate structure that with a simple configuration can effectively dissipate heat produced by circuit components, and that can suppress conduction to other components through a substrate. The substrate structure (20) comprises a plurality of proximal fuses (10) installed on the substrate (21), said structure being provided with a heat dissipation member (40) that covers the terminals (102a, 102b) of the proximal fuses (10), which have been soldered to one surface (23) of the substrate (21).
Inventors:
DAIDOJI TATSUYA (JP)
ODA AKIHIRO (JP)
HAMADA RYOMA (JP)
MATSUO YUYA (JP)
OKAMOTO NORIKO (JP)
ODA AKIHIRO (JP)
HAMADA RYOMA (JP)
MATSUO YUYA (JP)
OKAMOTO NORIKO (JP)
Application Number:
PCT/JP2021/027616
Publication Date:
March 10, 2022
Filing Date:
July 27, 2021
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H01L23/40; H01L23/12; H02G3/16; H05K1/02; H05K1/18; H05K7/20
Foreign References:
| JP2012119401A | 2012-06-21 | |||
| JP2001319708A | 2001-11-16 | |||
| JP2013149715A | 2013-08-01 | |||
| JPS5272177A | 1977-06-16 |
Attorney, Agent or Firm:
KOHNO, Hideto et al. (JP)
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