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Patent Searching and Data


Title:
SUBSTRATE SUPPORTING CARRIER PAD
Document Type and Number:
WIPO Patent Application WO2002016080
Kind Code:
A8
Abstract:
A carrier head assembly (200) of a substrate (202) polishing apparatus and a substrate supporting carrier pad (220) is disclosed. A down force is uniformly distributed over the backside of the substrate (202) by the carrier pad (220) adapted to be internally pressurized by the down force.

Inventors:
OLIVER MICHAEL R
Application Number:
PCT/US2001/025964
Publication Date:
August 22, 2002
Filing Date:
August 20, 2001
Export Citation:
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Assignee:
RODEL INC (US)
International Classes:
B24B37/30; B24B41/06; (IPC1-7): B24B37/04; B24B41/06
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