Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE SUPPORTS FOR A SPUTTERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/148243
Kind Code:
A3
Abstract:
A sputtering device and method including a chamber, a target disposed within the chamber, and a substrate support including at least a portion consisting essentially of a non-aluminous and non-magnetic metallic material disposed within the chamber. The substrate support may include a carrier and a fixture for holding a substrate. In some embodiments, at least the target-facing surface of the carrier consists essentially of a non-aluminous and non-magnetic metallic material. In some embodiments, the fixture consists essentially of a non-aluminous and non-magnetic metallic material. The sputtering device may be drum sputtering device. The sputtering method may be a magnetron sputtering method.

Inventors:
OUYANG XU (US)
PAN YALE G (US)
Application Number:
PCT/US2018/017166
Publication Date:
November 29, 2018
Filing Date:
February 07, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
CORNING INC (US)
International Classes:
C23C14/50; C23C14/34; H01J37/32; H01J37/34; H01L21/673; H01L21/687
Foreign References:
JP2013032574A2013-02-14
US20140193939A12014-07-10
US20160231464A12016-08-11
US20130025777A12013-01-31
US20090127760A12009-05-21
Attorney, Agent or Firm:
SCHMIDT, Jeffrey A (US)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ADJUSTABLE TRANSVERSE INDUCTORS FOR INDUCTIVELY HEATING STRIPS OR SLABS

Next Patent: KEY PROVISIONING AND IDENTITY PRIVACY FOR LPWAN