Title:
SUBSTRATE SURFACE SEALING DEVICE AND ORGANIC EL PANEL FABRICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2010/090223
Kind Code:
A1
Abstract:
Operating labor is diminished to improve takt time, and lamination that prevents deterioration of the performance of the finished product can be realized.
The cover films (13a) are peeled by a cover film uptake mechanism (15) (figure 4) from films (13) from film rolls (24a–24d) (figure 6) of a film out-feed mechanism (14), and then fed to an inter-substrate processing mechanism (16). In the inter-substrate processing mechanism (16), sheet sealing materials (5) (figure 3) are formed, in which specified lengths of the sealing material films (5') of the films (13) (figure 4) are peeled off at specified intervals, as shown in figure 9, by means of half-cut members (34) and a peel-off tape (36) (figure 7). The films (13), treated in this way, are fed into a lamination mechanism (19), where the sheet sealing materials (5) are heated and press-applied to a substrate (1) from the preceding chamber (10), and then cooled by a substrate cooling mechanism (30), and then the base films (13b) (figure 4) of the films (13) are peeled off by a base film uptake mechanism (21).
Inventors:
KUNIHIRO TATSUTO (JP)
TAKAHASHI KAZUO (JP)
OHTA YOSHIFUMI (JP)
TAKAHASHI KAZUO (JP)
OHTA YOSHIFUMI (JP)
Application Number:
PCT/JP2010/051517
Publication Date:
August 12, 2010
Filing Date:
February 03, 2010
Export Citation:
Assignee:
HITACHI PLANT TECHNOLOGIES LTD (JP)
SHARP KK (JP)
KUNIHIRO TATSUTO (JP)
TAKAHASHI KAZUO (JP)
OHTA YOSHIFUMI (JP)
SHARP KK (JP)
KUNIHIRO TATSUTO (JP)
TAKAHASHI KAZUO (JP)
OHTA YOSHIFUMI (JP)
International Classes:
H05B33/04; B29C65/78; G09F9/00; G09F9/30; H01L51/50; H05B33/10
Domestic Patent References:
| WO2008032526A1 | 2008-03-20 |
Foreign References:
| JP2001010005A | 2001-01-16 | |||
| JP2005212488A | 2005-08-11 | |||
| JP2005206852A | 2005-08-04 | |||
| JP2004146184A | 2004-05-20 | |||
| JP2007065521A | 2007-03-15 | |||
| JP2008050638A | 2008-03-06 | |||
| JP2004503066A | 2004-01-29 | |||
| JP2008287996A | 2008-11-27 | |||
| JP2005038816A | 2005-02-10 | |||
| JP2007112073A | 2007-05-10 | |||
| JP2007265880A | 2007-10-11 |
Attorney, Agent or Firm:
The Patent Body Corporate TAKEWA INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation Takekazu international patent firm (JP)
Patent business corporation Takekazu international patent firm (JP)
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