Title:
SUBSTRATE TERMINAL AND SUBSTRATE CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2015/068572
Kind Code:
A1
Abstract:
This substrate terminal (1) has: a base member (11) comprising a metal material; and a plating film (12) covering the surface of the base member (11). The plating film (12) is provided with an Sn matrix (120a) and an Sn-Pd alloy phase (120b) dispersed in the Sn matrix (120a), and the Sn matrix (120a) and Sn-Pd alloy phase (120b) have an outermost layer (120) present at the outer surface thereof. The Pd content of the outermost layer (120) is no greater than 7 at%. A substrate connector (2) has a substrate terminal (1) and a housing (20) that holds the substrate terminal (1).
Inventors:
WATANABE HAJIME (JP)
SAITOH YASUSHI (JP)
SAKA YOSHIFUMI (JP)
SAITOH YASUSHI (JP)
SAKA YOSHIFUMI (JP)
Application Number:
PCT/JP2014/078045
Publication Date:
May 14, 2015
Filing Date:
October 22, 2014
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C25D7/00; C25D5/50; H01R13/03; H01R12/58; H01R12/71
Domestic Patent References:
| WO2011001737A1 | 2011-01-06 | |||
| WO2013168764A1 | 2013-11-14 |
Foreign References:
| JP2003129278A | 2003-05-08 |
Attorney, Agent or Firm:
AICHI, Takahashi, Iwakura & Associates (JP)
Patent business corporation あいち international patent firm (JP)
Patent business corporation あいち international patent firm (JP)
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