SUBSTRATE, TOUCH PANEL SENSOR, MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE

Title:

SUBSTRATE, TOUCH PANEL SENSOR, MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2019/043790

Kind Code:

A1

Abstract:

The present invention suppresses that, even if the thickness of a substrate is increased, a conductive paste becomes excessively thin at an end edge of the substrate in the cases where the conductive paste is applied to an end portion of the substrate. The substrate is disposed on a base material, and the conductive paste is applied over a region from the end portion to the base material. At least a part of an end surface is a tapered surface inclined with respect to the thickness direction of the substrate.

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Inventors:

YOSHIHARA KENSUKE (JP)
AJIOKA YOSHIKI (JP)
SUZUKI GO (JP)

Application Number:

PCT/JP2017/030948

Publication Date:

March 07, 2019

Filing Date:

August 29, 2017

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

G06F3/041; G06F3/044

Foreign References:

JP2011113031A	2011-06-09
JP2014120003A	2014-06-30
JP2017068734A	2017-04-06
JP2004265392A	2004-09-24
US20140210738A1	2014-07-31

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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