Title:
SUBSTRATE TRANSFER DEVICE, SUBSTRATE PROCESSING DEVICE, AND METHOD OF TRANSFERRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2008/029608
Kind Code:
A1
Abstract:
A substrate transfer device capable of correcting the displacement of a substrate
in a horizontal direction by itself without using a transfer arm. The device comprises
support pins (132A to 132C) disposed around a support shaft (114) for a load stage
(112), separated from the support shaft (114), and supporting a substrate such
as a wafer (W) on its lower surface, a base (134) to which the support pins are fitted,
a vertical driving means (Z-direction drive means (138Z)) for elevating and
lowering the wafer (W) by vertically driving the support pins through the base,
and a horizontal drive means (X-direction drive means (138X), Y-direction drive
means (138Y)) for adjusting the position of the wafer in horizontal directions
(X-, Y-directions) by horizontally driving the support pins through the base.
Inventors:
HIROKI, Tsutomu (Mitsuzawa Hosaka-cho, Nirasaki-sh, Yamanashi 92, 4070192, JP)
Application Number:
JP2007/066087
Publication Date:
March 13, 2008
Filing Date:
August 20, 2007
Export Citation:
Assignee:
TOKYO ELECTRON LIMITED (3-6 Akasaka 5-chome, Minato-ku Tokyo, 81, 1078481, JP)
東京エレクトロン株式会社 (〒81 東京都港区赤坂五丁目３番６号 Tokyo, 1078481, JP)
東京エレクトロン株式会社 (〒81 東京都港区赤坂五丁目３番６号 Tokyo, 1078481, JP)
International Classes:
H01L21/68; H01L21/205; H01L21/3065; H01L21/677; H01L21/67; H01L21/02
Attorney, Agent or Firm:
OHYAMA, Hiroaki (Reo Akasaka Bldg. 5A, 2-14 Akasaka 6-chome,Minato-k, Tokyo 52, 1070052, JP)
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