Title:
SUBSTRATE TRANSPORTING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/169495
Kind Code:
A1
Abstract:
Provided is a substrate transporting method with which it is possible to place a substrate accurately at a desired angle of rotation. In order to eliminate rotational direction deviation of a wafer W in a vacuum processing chamber 11 that arises concomitant with variations in a transport distance of the wafer W, the wafer W is placed in a position that is offset from the center of a stage 20 in a load lock chamber 13, and an angle of rotation of the wafer W with respect to a fork 28 when a transporting arm 18 receives the wafer W is modified.
Inventors:
KONDOH KEISUKE (JP)
Application Number:
PCT/JP2017/008207
Publication Date:
October 05, 2017
Filing Date:
February 23, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; B25J13/08; B65G49/07
Foreign References:
| JPH04290455A | 1992-10-15 | |||
| JP2010199478A | 2010-09-09 |
Attorney, Agent or Firm:
BECCHAKU, Shigehisa et al. (JP)
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