Title:
SUBSTRATE TREATING DEVICE AND SUBSTRATE COOLING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/002499
Kind Code:
A1
Abstract:
The disclosed substrate treating device comprises: a chamber (11); a stage (12), which is arranged in the chamber (11), has a surface (12a) whereon groove sections (13) are provided, has a substrate (2) placed on the surface (12a) so as to form minute gaps (19), and which cools the substrate (2) by coming into contact with the substrate (2) and carrying out heat exchange; a gas supply unit which is located to the upper side of a first surface (2a) of the substrate (2) placed on the stage (12) and which introduces a prescribed gas into a first space (α) which is the space inside the chamber (11); and a control unit (17) which controls a first pressure (P1) and a second pressure (P2) so that the first pressure (P1), which is the pressure of the first space (α), is greater than the second pressure (P2), which is the pressure of a second space (β) that is located to the lower side of the substrate (2) and includes the groove sections (13) and the gaps (19) provided between the stage (12) and a second surface (2b) of the substrate (2).
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Inventors:
FUJII YOSHINORI (JP)
Application Number:
PCT/JP2011/065069
Publication Date:
January 05, 2012
Filing Date:
June 30, 2011
Export Citation:
Assignee:
ULVAC INC (JP)
FUJII YOSHINORI (JP)
FUJII YOSHINORI (JP)
International Classes:
H01L21/683
Foreign References:
| JPH08186074A | 1996-07-16 | |||
| JP2002252271A | 2002-09-06 | |||
| JP2009182235A | 2009-08-13 | |||
| JP2008251574A | 2008-10-16 | |||
| JP2004519104A | 2004-06-24 | |||
| JPH01313954A | 1989-12-19 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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Claims: