Title:
SUBSTRATE TREATMENT APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2017/149663
Kind Code:
A1
Abstract:
Provided is art having: a treatment chamber, into which a substrate holding tool holding a substrate and a heat insulating plate are carried, and in which the substrate is treated; a heating apparatus having a microwave supply unit that supplies microwaves to the inside of the treatment chamber; a gas supply unit that supplies a cooling gas to the inside of the treatment chamber; and a control unit configured to control the heating apparatus and the gas supply unit such that the substrate is maintained at a predetermined temperature by supplying the cooling gas from the gas supply unit at the time of heating the substrate by means of the heating apparatus.
Inventors:
HIROCHI YUKITOMO (JP)
Application Number:
PCT/JP2016/056275
Publication Date:
September 08, 2017
Filing Date:
March 01, 2016
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC (JP)
International Classes:
H01L21/324; H01L21/20; H01L21/265; H01L21/268
Foreign References:
| JP2015103726A | 2015-06-04 | |||
| JPS6143417A | 1986-03-03 | |||
| JP2010080555A | 2010-04-08 | |||
| JP2006032386A | 2006-02-02 | |||
| JP2012191158A | 2012-10-04 | |||
| JP2014033014A | 2014-02-20 | |||
| JP2014033003A | 2014-02-20 | |||
| JP2013152919A | 2013-08-08 |
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