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Title:
SUBSTRATE TREATMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/199689
Kind Code:
A1
Abstract:
A reduced-pressure drying apparatus (substrate treatment apparatus) (40) is provided with: a treatment chamber (41) for treating a mother glass substrate (substrate) (MG) by housing the mother glass substrate (MG); a supporting pin (45) for supporting the mother glass substrate (MG) in the treatment chamber (41), said supporting pin (45) having a rotatably supporting section (46) that rotatably supports the mother glass substrate (MG); and a swinging section (47) that swings the mother glass substrate (MG) along the substrate surface, said mother glass substrate being supported by the rotatably supporting section (46) in the treatment chamber (41).

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Inventors:
TOSHIMA MINORU
HIRAKO TAKAHIRO
INA HOKUTO
Application Number:
PCT/JP2016/066558
Publication Date:
December 15, 2016
Filing Date:
June 03, 2016
Export Citation:
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Assignee:
SHARP KK (JP)
International Classes:
H01L21/027; G02F1/13; G03F7/16; H01L21/336; H01L21/683; H01L29/786
Domestic Patent References:
WO2006022232A12006-03-02
Foreign References:
JP5724014B12015-05-27
JP2000243687A2000-09-08
JP2010050140A2010-03-04
JP2008166623A2008-07-17
JP2007226128A2007-09-06
JPH094974A1997-01-10
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
Patent business corporation dawn joint patent firm (JP)
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