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Title:
SUBSTRATE TREATMENT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/183360
Kind Code:
A1
Abstract:
The present invention has: a table that is provided with a polishing surface for polishing a substrate; and a discharging/sucking unit having a discharge port, which is in communication with a fluid supply source, and which discharges a fluid onto the polishing surface, and a suction port, which is in communication with a vacuum source, and which sucks the fluid on the polishing surface.

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Inventors:
SHINOZAKI HIROYUKI (JP)
Application Number:
PCT/JP2017/010158
Publication Date:
October 26, 2017
Filing Date:
March 14, 2017
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B08B3/02; B24B53/017; B08B5/00; B24B53/12; B24B55/06; H01L21/304; H01L21/683
Foreign References:
JPH10329009A1998-12-15
JP2007035973A2007-02-08
JP2001277095A2001-10-09
JPH11291155A1999-10-26
JP2014117776A2014-06-30
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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