Title:
SUBSTRATE TREATMENT DEVICE AND METHOD FOR MANUFACTURING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/131362
Kind Code:
A1
Abstract:
A substrate treatment device is provided with: a substrate holder (H) heated in a reduced-pressure heat treatment chamber, the substrate holder retaining a substrate (W); a transmission window (23) for transmitting radiant heat rays (La) radiated from the substrate holder (H) to the outside of the reduced-pressure heat treatment chamber; a radiation thermometer (25) for measuring the radiant heat rays (La) transmitted through the transmission window (23) outside the reduced-pressure heat treatment chamber; and a gas introduction device (24) for jetting a gas to the transmission window (23) from a gas introduction port (24a) that is open toward the transmission window (23) and introducing the gas into the reduced-pressure heat treatment chamber.
Inventors:
YOKOGAWA MASAHIRO (JP)
KAWASAKI TAKAHIRO (JP)
NAKAJIMA TAMOTSU (JP)
TANAKA YOSHIO (JP)
KAWASAKI TAKAHIRO (JP)
NAKAJIMA TAMOTSU (JP)
TANAKA YOSHIO (JP)
Application Number:
PCT/JP2017/044406
Publication Date:
July 19, 2018
Filing Date:
December 11, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C23C14/52; C23C14/50; C23C16/44; C23C16/46; G01J5/00; H01L21/205; H01L21/26; H01L21/3065; H01L21/324
Foreign References:
| JP2012230049A | 2012-11-22 | |||
| JPH0375357A | 1991-03-29 | |||
| JPH10106476A | 1998-04-24 | |||
| JP2002348656A | 2002-12-04 | |||
| JP2009027100A | 2009-02-05 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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