Title:
SUBSTRATE TREATMENT DEVICE, METHOD FOR SEPARATING BONDED SUBSTRATE, AND METHOD FOR REMOVING ADHSEIVE
Document Type and Number:
WIPO Patent Application WO/2015/046235
Kind Code:
A1
Abstract:
A substrate treatment device according to an embodiment is provided with: a treatment tank that stores a treatment liquid in which an object to be treated is immersed; a transfer unit that transfers the object to be treated; and a temperature control unit that is provided in the treatment tank and/or a place apart from the treatment tank, and heats and/or cools the object to be treated.
The object to be treated is at least any one of a bonded substrate having a device substrate, a support substrate, and an adhesive provided between the device substrate and the support substrate, the device substrate to which the adhesive adheres, and the support substrate to which the adhesive adheres.
Inventors:
KANAI TAKAHIRO (JP)
MATSUI EMI (JP)
HAYASHI KONOSUKE (JP)
MATSUI EMI (JP)
HAYASHI KONOSUKE (JP)
Application Number:
PCT/JP2014/075263
Publication Date:
April 02, 2015
Filing Date:
September 24, 2014
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP (JP)
International Classes:
H01L21/02; H01L21/304
Foreign References:
| JP2010287723A | 2010-12-24 | |||
| JP2011505684A | 2011-02-24 | |||
| JP2005109503A | 2005-04-21 | |||
| JPH0655152A | 1994-03-01 | |||
| JP2009517855A | 2009-04-30 | |||
| JP2010531385A | 2010-09-24 |
Other References:
See also references of EP 3051574A4
Attorney, Agent or Firm:
HYUGAJI, Masahiko et al. (JP)
Masahiko Hiugaji (JP)
Masahiko Hiugaji (JP)
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