Title:
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/097901
Kind Code:
A1
Abstract:
A substrate treatment method, whereby it becomes possible to supply a silicon-containing aqueous phosphate solution to a substrate having both of a silicon oxide film and a silicon nitride film exposed on the surface thereof so as to selectively etch the silicon nitride film. The method includes: a step of storing an aqueous phosphate solution containing silicon at a silicon concentration falling within a specified range in a tank; a step of supplying the aqueous phosphate solution in the tank to a nozzle and supplying the aqueous phosphate solution to the substrate through the nozzle to treat the substrate; a collection step of collecting the aqueous phosphate solution used for the treatment of the substrate in the tank; a first aqueous phosphate solution supply step of supplying a first aqueous phosphate solution containing silicon at a first concentration to the tank; a second aqueous phosphate solution supply step of supplying a second aqueous phosphate solution containing silicon at a second concentration that is lower than the first concentration to the tank; a start judgement step of starting the first and second aqueous phosphate solution supply steps when specified filling start conditions are satisfied; and a supply amount determination step of determining supply amounts of the first and second aqueous phosphate solutions.
Inventors:
HORIGUCHI OSAMU (JP)
Application Number:
PCT/JP2018/037581
Publication Date:
May 23, 2019
Filing Date:
October 09, 2018
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306
Domestic Patent References:
WO2017057727A1 | 2017-04-06 |
Foreign References:
JP2013165217A | 2013-08-22 | |||
JP2016032029A | 2016-03-07 | |||
JPH11300190A | 1999-11-02 | |||
JP2015135943A | 2015-07-27 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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