Title:
SUBSTRATE TREATMENT METHOD AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2017/069203
Kind Code:
A1
Abstract:
A substrate treatment method for treating a substrate using a block copolymer that contains a hydrophilic polymer and a hydrophobic polymer, the method including: a block copolymer coating step for forming a block copolymer coating film by applying a coat of the block copolymer onto the substrate, on which a prescribed concavoconvex pattern is formed; a polymer separation step for phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer; a polymer removal step for selectively removing the hydrophilic polymer from the phase-separated block copolymer; and a film-thickness reduction step for reducing the film thickness of the block copolymer coating film, before performing the polymer removal step and after performing the block copolymer coating step.
Inventors:
MURAMATSU MAKOTO (JP)
TOMITA TADATOSHI (JP)
GENJIMA HISASHI (JP)
KITANO TAKAHIRO (JP)
TOMITA TADATOSHI (JP)
GENJIMA HISASHI (JP)
KITANO TAKAHIRO (JP)
Application Number:
PCT/JP2016/081118
Publication Date:
April 27, 2017
Filing Date:
October 20, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; B05D3/10
Domestic Patent References:
| WO2014139793A1 | 2014-09-18 |
Foreign References:
| JP2016105455A | 2016-06-09 | |||
| JP2014060189A | 2014-04-03 | |||
| JP2014090029A | 2014-05-15 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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