Title:
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/045975
Kind Code:
A1
Abstract:
Provided are a substrate treatment method and a substrate treatment device enabling greater suppression of corrosion or oxidation of metal wiring exposed on a substrate surface. The present invention relates to a substrate treatment device (1) having a treatment chamber (2) wherein a substrate (W) is disposed, and whereto a substrate treatment solution for treating the substrate (W) is supplied. This device is provided with an inert gas filling mechanism (18, 39, 41) for filling with an inert gas the interior of the treatment chamber (2) wherein the substrate (W) is disposed, and, near or inside the treatment chamber (2), a catalytic unit (21) filled with a platinum-group metal catalyst wherethrough a hydrogen-dissolved water comprising hydrogen added to ultra-pure water is passed. Obtained by passing the hydrogen-dissolved water through the platinum-group metal catalyst, a hydrogen-dissolved treatment solution is supplied as the substrate treatment solution into the treatment chamber (2) by the device.
Inventors:
YANO DAISAKU (JP)
YAMASHITA YUKINARI (JP)
MURAYAMA MASAMI (JP)
YAMANAKA KOJI (JP)
YAMASHITA YUKINARI (JP)
MURAYAMA MASAMI (JP)
YAMANAKA KOJI (JP)
Application Number:
PCT/JP2014/074481
Publication Date:
April 02, 2015
Filing Date:
September 17, 2014
Export Citation:
Assignee:
ORGANO CORP (JP)
International Classes:
H01L21/304
Foreign References:
| JP2003136077A | 2003-05-13 | |||
| JPH0451521A | 1992-02-20 | |||
| JP2010056218A | 2010-03-11 | |||
| JP2010214321A | 2010-09-30 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
Akio Miyazaki (JP)
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